Adhesive die attachment method for a semiconductor die and...

Details Adhesive die attachment method for a semiconductor die and... Adhesive die attachment method for a semiconductor die and...

2005-11-22

2005-11-22

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S119000

Reexamination Certificate

active

06967123

ABSTRACT:
The invention relates to an adhesive attaching method for attaching a semiconductor die to a substrate in which an adhesive is deposited onto the substrate, the deposited adhesive is partially cured and/or dried, the partially cured and/or dried adhesive is reheated and a semiconductor die is placed onto the reheated adhesive, after which the adhesive is fully cured so that the semiconductor die is bonded, both electrically and mechanically, to the substrate.

REFERENCES:
patent: 6017776 (2000-01-01), Jiang et al.
patent: 6046072 (2000-04-01), Matsuura et al.
patent: 6395998 (2002-05-01), Farquhar et al.
patent: 6458237 (2002-10-01), Tsunoi et al.
patent: 6689638 (2004-02-01), Lin et al.
patent: 6692610 (2004-02-01), Low et al.
patent: 6710462 (2004-03-01), Jiang
patent: 6753922 (2004-06-01), Sengupta et al.

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