Adhesive copolyamide composition based on phenylene containing d

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

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528325, 5283291, 528331, 528337, 528338, 528339, 528340, 528347, C08G 6914

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active

049436252

ABSTRACT:
An adhesive copolyamide composition having a dry powder DSC melting point of at least 100.degree. C., a glass transition temperature above 60.degree. C., a dry powder softening point of at least 100.degree. C., preferably a water content after storage in water of more than 20% by weight, and a wet softening point of less than 100.degree.. Such compositions exhibit softening points and heat resistances in excess of 100.degree. C. and can be processed and set at substantially lower temperatures. No low molecular weight additives are required nor are any solvents necessary. The compositions are comparable in their heat-resistance, softening points, and bond strength to conventional high performance hot melt adhesives.

REFERENCES:
patent: 3919033 (1975-11-01), Gill et al.
patent: 4024116 (1977-05-01), Horn et al.
patent: 4102871 (1978-07-01), Horn et al.
patent: 4118351 (1978-10-01), Murray et al.
patent: 4386197 (1983-05-01), Panoch et al.
patent: 4566931 (1986-01-01), Panoch et al.

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