Adhesive comprising cured amino resin powder for printed circuit

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525405, 525406, 525451, 528107, 528250, 528421, 528407, 522100, 522111, 522153, 522170, 428200, 428209, 428901, C09J 702, C09J16124, C09J16128, C09J16300

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active

054479967

ABSTRACT:
There are disclosed an adhesive obtained by dispersing a cured amino resin fine powder soluble in acid or oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent when being subjected to a curing treatment as well as a printed circuit board using this adhesive and a method of producing the same. The adhesive has excellent properties such as resistance to chemicals, heat resistance, electric properties, hardness and adhesion property owing to the use of the amino resin fine powder. Therefore, the printed circuit board using such an adhesive is not influenced by service circumstance and is high in the connection reliability without forming short circuit between patterns. Furthermore, in the method of producing the printed circuit board, the adhesive is provided in form of a sheet-or a prepreg, whereby the printed circuit board can be produced easily and cheaply.

REFERENCES:
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patent: 4504607 (1985-03-01), Leech
patent: 4752499 (1988-06-01), Enomoto
patent: 5021472 (1991-06-01), Enomoto
patent: 5055321 (1991-10-01), Enomoto
patent: 5137936 (1992-08-01), Akiguchi et al.
Moore, J. A., Editor, "Macromolecular Synthese", Methods for the Preparation of Macromolecules, Collective vol. 1, pp. 257-264, 1977.

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