Adhesive compositions for electronic packages

Details Adhesive compositions for electronic packages Adhesive compositions for electronic packages

1992-10-02

1993-12-14

Morgan, Kriellion S.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524403, 524492, C08K 507, C08K 336, C08K 310

Patent

active

052703711

ABSTRACT:
Chip adhesives with improved working time comprise a polyetherimide prepared from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and bis(4-aminophenyl) sulfone; at least one of silica and conductive metal particles, especially silver particles; and at least one substituted acetophenone as solvent. The preferred substituted acetophenone is 4-methylacetophenone.

REFERENCES:
patent: 3501443 (1970-03-01), DiLeone
patent: 3607814 (1971-09-01), DiLeone
patent: 4377652 (1983-03-01), Ohmura et al.
patent: 4495321 (1985-01-01), Arnold
patent: 4565858 (1986-01-01), Klopfer
patent: 5019535 (1991-05-01), Wojnarowski et al.
patent: 5145899 (1992-09-01), Auman

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