Adhesive compositions for electronic applications

Details Adhesive compositions for electronic applications Adhesive compositions for electronic applications

1996-11-21

1998-06-30

Short, Patricia A.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Release layer

428413, 4284231, 4284735, 428480, 525440, 525453, 525454, 525456, C09J17110, C09J17504

Patent

active

057731136

ABSTRACT:
Adhesive compositions for electronic applications contain a hydroxyl-bearing resin, a thermoplastic urethane and a curing agent.

REFERENCES:
patent: 3728150 (1973-04-01), Yuan
patent: 3822175 (1974-07-01), Yuan
patent: 3900662 (1975-08-01), Yuan
patent: 4264669 (1981-04-01), Yuan
patent: 4347286 (1982-08-01), Ishikzuka et al.
patent: 4977003 (1990-12-01), Brown et al.
patent: 5271964 (1993-12-01), Ohishi
patent: 5277972 (1994-01-01), Sakumoto et al.
patent: 5317067 (1994-05-01), Yagi
patent: 5494757 (1996-02-01), Sakumoto et al.
patent: 5496886 (1996-03-01), Courlias
patent: 5500294 (1996-03-01), Sakumoto et al.

Affiliated with

Also associated with

Rating

Adhesive compositions for electronic applications does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive compositions for electronic applications, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive compositions for electronic applications will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1856733