Adhesive compositions for bonding passive substrates

Details Adhesive compositions for bonding passive substrates Adhesive compositions for bonding passive substrates

2006-10-03

2006-10-03

Yoon, Tae H. (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C520S001000, C520S001000, C520S001000, C520S001000, C427S327000

Reexamination Certificate

active

07115676

ABSTRACT:
Adhesive compositions are disclosed which cure rapidly and completely on confinement between passive substrates, such as magnesium alloys, that are deficient in transition metals and transition metal ions. The compositions include one or more acrylate resins, one or more peroxy free radical initiators, one or more onium salts, and an accelerator such as acetylphenyl hydrazine desirably in an amount of about 1.0% or less by weight of the composition. These compositions provide exceptional bonding to such substrates without the need for a transition metal primer. Methods of making and using such compositions are also disclosed.

REFERENCES:
patent: 3425988 (1969-02-01), Gorman et al.
patent: 4018851 (1977-04-01), Baccei
patent: 4287330 (1981-09-01), Rich
patent: 4295909 (1981-10-01), Baccei
patent: 4336363 (1982-06-01), Crivello
patent: 4968383 (1990-11-01), Volkmann et al.
patent: 5411998 (1995-05-01), McArdle et al.
patent: 5550201 (1996-08-01), Kneafsey et al.
patent: 0 581 532 (1994-02-01), None
patent: 49 120889 (1974-11-01), None

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