Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...
Reexamination Certificate
2009-07-23
2010-02-02
Shosho, Callie E (Department: 1794)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Polymers from only ethylenic monomers or processes of...
C525S050000, C525S055000, C525S326100, C525S333100, C428S343000, C428S3550RA, C428S3550EN
Reexamination Certificate
active
07655739
ABSTRACT:
Adhesive composition comprises a polyfarnesene and a tackifier. The polyfarnesene can be a farnesene homopolymer derived from a farnesene (e.g., α-farnesene or β-farnesene) or a farnesene interpolymer derived from a farnesene and at least a vinyl monomer. In some embodiments, the at least one vinyl monomer is ethylene, an α-olefin such as styrene, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof. The composition disclosed herein can be used as a hot melt adhesive, a pressure sensitive adhesive or the like.
REFERENCES:
patent: 5209971 (1993-05-01), Babu et al.
patent: 0007758 (1980-02-01), None
Monakov et al., The Reactivity of Isoprene and Its Copolymerization with Straight-chain Tetraene, Prom.-et. Sint. Kauch., 1979, 4; Chem. Abstr. 1979, 91, 176428p.
Newmark et al.,13C-NMR Spectra of cis-Polymyrcene and cis-Polyfarnesene, J. of Polymer Sci.: Part A: Polymer Chemistry, 1988, vol. 26, p. 71-77.
Graham Matthew J.
McPhee Derek James
Amyris Biotechnologies, Inc.
Ducheneaux Frank D
Jones Day
Shosho Callie E
LandOfFree
Adhesive compositions comprising a polyfarnesene does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive compositions comprising a polyfarnesene, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive compositions comprising a polyfarnesene will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4170419