Adhesive compositions and copper foils and copper clad laminates

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428408, 428413, 428417, 428418, 428446, 428457, 428901, 525109, 525113, B32B 300

Patent

active

061328510

ABSTRACT:
This invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula ##STR1## wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, NR.sup.1.sub.2, C(O)NHR.sup.1, R.sup.2 NR.sup.1.sub.2, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R.sup.1, OR.sup.1 or SO.sub.2 C.sub.6 H.sub.4 --NH.sub.2 ; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

REFERENCES:
patent: 3496130 (1970-02-01), Wasem et al.
patent: 3935053 (1976-01-01), Armstrong
patent: 4020225 (1977-04-01), Fujiwara
patent: 4246162 (1981-01-01), Schreiber
patent: 4343843 (1982-08-01), Johnson
patent: 5061550 (1991-10-01), Shimizu
patent: 5071914 (1991-12-01), Zimmel
Search Report for European Appl. 95304380.9.
Epoxy Resins, Chem. & Tech., May, 8, 1989 Marcel Dekker Inc., pp. 683-691, 1089-1095.

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