Adhesive compositions and copper foils and copper clad...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Reissue Patent

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Details

C428S408000, C428S413000, C428S417000, C428S418000, C428S446000, C428S457000, C428S901000, C525S109000, C525S113000

Reissue Patent

active

10617653

ABSTRACT:
The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formulawherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(═NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2and R2NHR1, wherein R1is a hydrocarbon group, R2is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

REFERENCES:
patent: 3496130 (1970-02-01), Wasem et al.
patent: 3935053 (1976-01-01), Armstrong
patent: 4020225 (1977-04-01), Fujiwara
patent: 4246162 (1981-01-01), Schreiber
patent: 4343843 (1982-08-01), Johnson
patent: 5061550 (1991-10-01), Shimizu
patent: 5071914 (1991-12-01), Simmel
patent: 0012714 (1980-06-01), None
patent: 0148493 (1986-08-01), None
patent: 0371242 (1990-06-01), None
patent: 62-101674 (1987-05-01), None
Search Report for European Application 95304380.9.
Epoxy Resins, Chem & Tech., May 8, 1989, Marcel Dekker Inc., pp. 683-691, 1089-1095.

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