Adhesive compositions

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

524861, 524862, C08K 554

Patent

active

052760863

ABSTRACT:
Adhesive compositions of this invention are characterized by the addition of certain silane compounds as adhesion promoters to addition curing type compositions which comprise a diorganopolysiloxane containing alkenyl groups bonded to silicon atoms and an organohydrogen polysiloxane containing hydrogen atoms bonded to silicon atoms, wherein the adhesion promoting silane compound, is of the formula: ##STR1## wherein R.sup.1 and R.sup.2 are either hydrogen atoms or lower alkyl groups, R.sup.3 and R.sup.4 are preferably lower alkyl groups and a and n are integers from 0 to 2.

REFERENCES:
patent: 3699072 (1972-10-01), Clark et al.
patent: 3837876 (1974-09-01), Mayuzumi et al.
patent: 4196273 (1980-04-01), Imai et al.
patent: 4329273 (1982-05-01), Hardman et al.
patent: 4433007 (1984-02-01), Marwitz et al.
patent: 4677161 (1987-06-01), Suzuki et al.
patent: 5023288 (1991-06-01), Hirai et al.
patent: 5173529 (1992-12-01), Fujiki et al.
patent: 5180771 (1993-01-01), Arai et al.
Database WPIL, Derwent Publications Ltd., London, GB AN 91-158425 & JP-A-3 091 564 (Shin Etsu Chem. Ind. KK) Apr. 17, 1991.
Derwent Publication of Japan Kokai (Laid-Open) 50-39345.
Derwent Publication of Japan Kokoku (Examined) 55-41702.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Adhesive compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive compositions will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-307834

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.