Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having a component wherein a constituent is liquid...
Patent
1998-01-23
2000-02-08
Jones, Deborah
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Composite having a component wherein a constituent is liquid...
428 402, 428200, 428402, 428325, 428327, 252514, 257717, B32B 326
Patent
active
060226161
ABSTRACT:
This invention is an improved adhesive composition prepared from at least one organic polymer resin, an inorganic filler, and a fugitive liquid, in which the liquid and organic polymer resin are each substantially insoluble in the other; and in which the improvement comprises that the at least one organic polymer resin be present in particulate form of particle size that is 25.mu. or smaller. Adhesive compositions so prepared can be used on dies-400 mil.times.400 mil or greater on metal substrates without significant delamination.
REFERENCES:
patent: 2983853 (1961-05-01), Williams
patent: 3526814 (1970-09-01), Piedra et al.
patent: 4545840 (1985-10-01), Newman et al.
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 5391604 (1995-02-01), Dietz et al.
patent: 5488082 (1996-01-01), Dietz et al.
patent: 5539253 (1996-07-01), Nagaune
patent: 5552637 (1996-09-01), Yamagata
patent: 5650662 (1997-07-01), Edwards et al.
patent: 5721455 (1998-02-01), Takashita
patent: 5770706 (1998-06-01), Wu et al.
patent: 5854315 (1998-12-01), Wu et al.
patent: 5856383 (1999-01-01), Wu et al.
Costello Timothy G.
Jun Kathy M.
Wu Bing
Gennaro Jane E.
Jones Deborah
Lam Cathy F.
National Starch and Chemical Investment Holding Corporation
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