Adhesive composition with increased cure rate

Details Adhesive composition with increased cure rate Adhesive composition with increased cure rate

2005-04-19

2005-04-19

Truong, Duc (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From aldehyde or derivative thereof as reactant

C528S243000, C528S254000, C528S256000, C428S502000, C428S566000, C427S372200, C427S374200, C427S369000

Reexamination Certificate

active

06881817

ABSTRACT:
Adhesive composition consisting of an aminoplast resin with a free formaldehyde-like compound being present. In particular an adhesive composition consisting of a melamine-urea-formaldehyde resin to which a free formaldehyde-like compound has been added so that F/(NH2)2is equal to 0.8-1.6. The adhesive is in particular suitable for the preparation of board material by combining in a press cellulose-containing materials with the adhesive according to the invention and in this press manufacturing board material at elevated temperature and pressure.

REFERENCES:
patent: 4997905 (1991-03-01), Druet et al.
English Abstract of EP 0 436 485.
English Abstract of EP 0 001 596.
English Abstract of CH 188327.

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