Stock material or miscellaneous articles – Composite – Of epoxy ether
Patent
1974-12-09
1976-06-08
Drummond, Douglas J.
Stock material or miscellaneous articles
Composite
Of epoxy ether
156330, 156332, 156331, 260 37EP, 260830P, 260 40TN, 260835, 260 75TN, 260836, 428424, 428482, 428416, 428480, 428901, E05B 348, E05B 396, C09J 300
Patent
active
039625206
ABSTRACT:
As an adhesive used for a laminate for a flexible printed circuit, there is provided an adhesive composition comprising as the essential components a polyester resin, an isocyanate compound, and a B-stage epoxy resin.
This composition is excellent in flow property and rapid curability and is suitable for use in a continuous adhesion between a plastic insulating film and a conductive foil by means of a roll-laminator and it affords an excellent characteristic to the laminate a printed circuit.
There is also provided an adhesive composition which contains, in addition to the above ingredients, a styrene copolymer comprising maleic anhydride, or an alkyl maleate as a structural unit, or a metallic salt of an aliphatic carboxylic acid in order to prevent blocking and promote curing of the adhesive in a roll laminating process.
The addition of a small amount of a pigment results in an adhesive composition which is effective in the economical production of a laminate for a colored flexible printed circuit, and which has the effect of preventing the blocking and improving the weather resistance of the adhesive.
REFERENCES:
patent: 2519764 (1950-08-01), Jacobson
patent: 3063958 (1962-11-01), Perkins et al.
patent: 3140566 (1964-07-01), Wagner
patent: 3265664 (1966-08-01), Fulmer et al.
patent: 3468824 (1969-09-01), Williams
patent: 3551517 (1970-12-01), Dowbenko et al.
patent: 3574048 (1971-04-01), Klimisch
patent: 3616019 (1971-10-01), Mueller-Tamm et al.
patent: 3644569 (1972-02-01), Pietsch et al.
patent: 3660199 (1972-05-01), Riccitiello et al.
Tanaka Koichi
Watanabe Tsutomu
Yamaoka Shigenori
Drummond Douglas J.
Flocks Karl W.
Gallagher J. J.
Sumitomo Bakelite Company Limited
LandOfFree
Adhesive composition for flexible printed circuit and method for does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive composition for flexible printed circuit and method for, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive composition for flexible printed circuit and method for will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1101313