Adhesive composition for bonding a semiconductor device

Details Adhesive composition for bonding a semiconductor device Adhesive composition for bonding a semiconductor device

1997-06-04

1998-04-28

Cain, Edward J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524439, C08K 300

Patent

active

057445338

ABSTRACT:
Described is an adhesive composition suitable for bonding a semiconductor device to a substrate comprising about 60-90 wt. % particulate silver; about 10-40 wt. % of an adhesive material comprising at least one nonelectrically conductive organic compound; and a filler comprising at least one electrically conductive organic compound capable of forming a conductivity bridge between silver particles. The adhesive composition may additionally include at least one curing catalyst for the adhesive material, a flexibilizer to render the composition more flexible, a surfactant to facilitate contact with a substrate and/or a material to aid in adjusting the rheology of the composition.

REFERENCES:
patent: 5358992 (1994-10-01), Dershem et al.
patent: 5475048 (1995-12-01), Jamison et al.
patent: 5498372 (1996-03-01), Hedges
patent: 5612403 (1997-03-01), Nguyen et al.

Affiliated with

Also associated with

Rating

Adhesive composition for bonding a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive composition for bonding a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive composition for bonding a semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1532567