Adhesive composition and coverlay film therewith

Details Adhesive composition and coverlay film therewith Adhesive composition and coverlay film therewith

1992-03-26

1993-11-09

Zirker, Daniel

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428356, 4284735, 428483, 428901, 525113, B32B 712, C08L 6310, C08L 6302

Patent

active

052601307

ABSTRACT:
A coverlay film, which is used for protection of a flexible printed circuit board, is provided by the invention as being imparted with improved adhesiveness, heat-resistance against molten solder alloy, punching workability and other properties. The inventive coverlay film is characterized by the novel and unique formulation of the adhesive to form an adhesive layer on one surface of a substrate plastic, e.g., polyimide, film. The adhesive is formulated with an epoxy resin, carboxylated nitrile rubber, curing agent for the epoxy resin, curing accelerator and fine inorganic powder each of a specified type and in a specified weight proportion.

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