Adhesive composition and adhesive film

Details Adhesive composition and adhesive film Adhesive composition and adhesive film

2008-04-29

2008-04-29

Zimmer, Marc S. (Department: 1796)

Stock material or miscellaneous articles

Composite

Of silicon containing

C528S026000, C528S038000, C525S473000, C428S413000, C428S450000, C428S473500, C428S480000, C428S500000

Reexamination Certificate

active

07364797

ABSTRACT:
An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.

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