Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-05-23
2010-11-30
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S455000, C438S458000, C438S464000
Reexamination Certificate
active
07842551
ABSTRACT:
The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group. According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.
REFERENCES:
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 5118567 (1992-06-01), Komiyama et al.
patent: 5356949 (1994-10-01), Komiyama et al.
patent: 5919602 (1999-07-01), Herr et al.
patent: 6187340 (2001-02-01), Fukuta et al.
patent: 6277481 (2001-08-01), Sugino et al.
patent: 6645617 (2003-11-01), Okazaki et al.
patent: 6673441 (2004-01-01), Tanaka et al.
patent: 7262514 (2007-08-01), Yoshikawa et al.
patent: 2007/0026572 (2007-02-01), Hatakeyama et al.
patent: 2007/0036971 (2007-02-01), Inada et al.
patent: 2007/0137782 (2007-06-01), Matsumura et al.
patent: 2007/0238802 (2007-10-01), Harada et al.
patent: 2007/0241436 (2007-10-01), Ookubo et al.
patent: 2008/0124839 (2008-05-01), Saiki et al.
patent: 2009/0005480 (2009-01-01), Nakamura et al.
patent: 2009/0186955 (2009-07-01), Inada et al.
patent: 2009/0253876 (2009-10-01), Funaya et al.
patent: 2032181 (1990-02-01), None
patent: 8239636 (1996-09-01), None
patent: 10008001 (1998-01-01), None
patent: 2000017246 (2000-01-01), None
patent: 2002012819 (2002-01-01), None
patent: 2002194061 (2002-07-01), None
patent: 2002302531 (2002-10-01), None
patent: 2004043667 (2004-02-01), None
patent: 2005167176 (2005-06-01), None
patent: 20063358860 (2006-12-01), None
CAS registry No. 112755-07-4 for MEH 7500 or 7500-3S phenol-salicylaldehyde copolymer, 2009, one page.
Ichikawa Isao
Saiki Naoya
Shizuhata Hironori
Yamazaki Osamu
Lintec Corporation
Picardat Kevin M
The Webb Law Firm
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