Adhesive composition, adhesive sheet and production method...

Details Adhesive composition, adhesive sheet and production method... Adhesive composition, adhesive sheet and production method...

2009-03-31

2010-12-14

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C428S3550EP, C156S329000, C523S209000

Reexamination Certificate

active

07851335

ABSTRACT:
The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness.The adhesive composition of the present invention comprises:(A) an acrylic polymer;(B) an epoxy resin;(C) a thermosetting agent; and(D) a silicone compound having a specific side chain.

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