Adhesive composition, adhesive composition for circuit...

Details Adhesive composition, adhesive composition for circuit... Adhesive composition, adhesive composition for circuit...

2005-05-27

2009-08-18

McClendon, Sanza L (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S163000, C522S164000, C522S178000, C522S182000, C428S356000, C428S3550BL, C428S3550EN, C428S3550AC, C428S3550CN, C428S3550EN, C427S457000, C427S487000, C427S508000, C427S516000, C427S207100, C427S208200, C427S208400

Reexamination Certificate

active

07576141

ABSTRACT:
An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.

REFERENCES:
patent: 1-113480 (1989-05-01), None
patent: 9-125011 (1997-05-01), None
patent: 9-241585 (1997-09-01), None
patent: 11-26688 (1999-01-01), None
patent: 11-140387 (1999-05-01), None
patent: 2000072851 (2000-03-01), None
patent: 2000-239616 (2000-09-01), None
patent: 2001-11135 (2001-01-01), None
patent: 2002-12603 (2002-01-01), None
patent: 2002-12637 (2002-01-01), None
patent: 2002167556 (2002-06-01), None
patent: 2002-203427 (2002-07-01), None
patent: 2002-363218 (2002-12-01), None
patent: 2003-321508 (2003-11-01), None
patent: 2004-18715 (2004-01-01), None
Chinese Office Action dated Feb. 10, 2006, issued in corresponding Chinese Patent Application No. 2003801005869.
Office Action dated Feb. 2, 2007 issued in corresponding Taiwan application No. 92133727.
Japanese Office Action dated Jun. 24, 2008 (mailing date), issued in corresponding Japanese Patent Application No. 2004-556874.

Affiliated with

Also associated with

Rating

Adhesive composition, adhesive composition for circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive composition, adhesive composition for circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive composition, adhesive composition for circuit... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4070075