Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-01-11
2005-01-11
Lorengo, J. A. (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S247000, C156S249000, C156S251000, C156S258000, C156S273500, C427S096400, C427S148000, C428S145000, C428S202000, C428S3550EP, C428S914000
Reexamination Certificate
active
06841022
ABSTRACT:
An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.
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Patent Abstracts of Japan, vol. 016, No. 472 (E-1272), Sep. 30, 1992 & JP 04 169080A (Shin ETSU Polymer Co. LTD.), Jun. 17, 1992.
Fukushima Naoki
Kobayashi Kouji
Koide Jyunichi
Matsuda Kazuya
Tsukagoshi Isao
Hitachi Chemical Company Ltd.
Lorengo J. A.
Wenderoth , Lind & Ponack, L.L.P.
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