Adhesive clad insulating substrate used for producing printed ci

Stock material or miscellaneous articles – Composite – Of addition polymer from unsaturated monomers

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428413, 428331, 428522, 428524, 428460, 428901, 29829, 204 30, 260 3, 260845, 174259, 427 98, B32B 2708, C08L 6110

Patent

active

048370860

ABSTRACT:
An insulating substrate having a layer of an adhesive composition comprising (A) a modified phenolic resin and (B) acrylonitrile-butadiene rubber on at least one surface of a substrate is suitable for producing printed circuit boards having excellent solder heat resistance by an additive process.

REFERENCES:
patent: 3625758 (1971-12-01), Stahl et al.
patent: 4007233 (1977-02-01), Kako et al.
patent: 4029845 (1977-06-01), Nomura
patent: 4257926 (1981-03-01), Tanimura et al.
patent: 4360560 (1982-11-01), Kopnick et al.
patent: 4457952 (1984-07-01), Kawamoto et al.

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