Adhesive clad insulating substrate used for producing printed ci

Details Adhesive clad insulating substrate used for producing printed ci Adhesive clad insulating substrate used for producing printed ci

1986-01-31

1989-06-06

Ives, P. C.

Stock material or miscellaneous articles

Composite

Of addition polymer from unsaturated monomers

428413, 428331, 428522, 428524, 428460, 428901, 29829, 204 30, 260 3, 260845, 174259, 427 98, B32B 2708, C08L 6110

Patent

active

048370860

ABSTRACT:
An insulating substrate having a layer of an adhesive composition comprising (A) a modified phenolic resin and (B) acrylonitrile-butadiene rubber on at least one surface of a substrate is suitable for producing printed circuit boards having excellent solder heat resistance by an additive process.

REFERENCES:
patent: 3625758 (1971-12-01), Stahl et al.
patent: 4007233 (1977-02-01), Kako et al.
patent: 4029845 (1977-06-01), Nomura
patent: 4257926 (1981-03-01), Tanimura et al.
patent: 4360560 (1982-11-01), Kopnick et al.
patent: 4457952 (1984-07-01), Kawamoto et al.

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