Adhesive chuck and substrate bonding apparatus

Details Adhesive chuck and substrate bonding apparatus Adhesive chuck and substrate bonding apparatus

2011-07-19

2011-07-19

Tucker, Philip C (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C156S539000, C156S556000, C156S580000, C156S750000

Reexamination Certificate

active

07980287

ABSTRACT:
A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.

REFERENCES:
patent: 5980663 (1999-11-01), Badehi
patent: 2006276669 (2006-10-01), None
English Abstract of JP 2006-276669A.
Machine Translation of JP 2006-276669A.

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