Adhesive chuck, and apparatus and method for assembling...

Details Adhesive chuck, and apparatus and method for assembling... Adhesive chuck, and apparatus and method for assembling...

2011-04-12

2011-04-12

Tucker, Phillip C (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With separate heating means for work

C156S580000, C156S583100, C156S247000, C029S830000, C029S760000, C029S834000, C029S900000

Reexamination Certificate

active

07921895

ABSTRACT:
An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs.

REFERENCES:
patent: 4770600 (1988-09-01), Ishikawa
patent: 5980663 (1999-11-01), Badehi
patent: 6722026 (2004-04-01), Lent
patent: 7239589 (2007-07-01), Feehan et al.
patent: 11104773 (1999-04-01), None
patent: 2002124559 (2002-04-01), None
patent: WO 2004/097509 (2004-11-01), None
English Abstract of JP 2002-124559A.
Machine English Translation of JP 2002-124559A.
Machine English Translation of JP 11-104773.
English Abstract of JP 11-104773.

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