Adhesive bonding of poly(arylene sulfide) surfaces

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156154, 156182, 156242, 156322, 427207D, 427223, 427224, 427290, 428416, 428419, 428457, B32B 3112, B29C 1712, B32B 712, B32B 3126

Patent

active

040111210

ABSTRACT:
Pretreating a first solid surface consisting of a material selected from the group consisting of unfilled poly(arylene sulfide) and fiberglass-filled poly(arylene sulfide) by mechanically roughening this first surface or pretreating with flame a first solid surface of unfilled poly(arylene sulfide) greatly increases the lap shear strength of an adhesive bond of such a first poly(arylene sulfide) surface to a second solid surface as compared to the same bond without pretreatment of the poly(arylene sulfide) surface.

REFERENCES:
patent: 2747180 (1956-05-01), Brucker
patent: 3193424 (1965-07-01), Scott
patent: 3354129 (1967-11-01), Edmonds, Jr. et al.
patent: 3616186 (1971-10-01), Blackwell
patent: 3620402 (1971-11-01), Wentland
patent: 3622376 (1971-11-01), Tieszen
patent: 3634125 (1972-01-01), Tieszen
patent: 3879238 (1975-04-01), Bierman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Adhesive bonding of poly(arylene sulfide) surfaces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive bonding of poly(arylene sulfide) surfaces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive bonding of poly(arylene sulfide) surfaces will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1404920

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.