Adhesive bonding

Details Adhesive bonding Adhesive bonding

1985-07-11

1987-02-24

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Polymers from only ethylenic monomers or processes of...

525259, 526213, 526216, 526220, C08F 202

Patent

active

046458107

ABSTRACT:
A method of forming an adhesive bond between substrates at least one of which comprises a surface of zinc is described and claimed. The method comprises applying to one or more of the substrates to be bonded an adhesive composition comprising polymerizable acrylic monomer, free radical initiator, thiourea accelerator compound and an organic dibasic acid compound which is a dibasic acid or dibasic acid anhydride, and bringing the substrates together to form an adhesive bond. Compositions described permit improved adhesion to zinc surfaces and preferably include methyl methacrylate or tetrahydrofurfuryl methacrylate, a hydroxymethacrylate and a dimethacrylate. Preferred dibasic acid compounds include succinic acid and maleic acid.

REFERENCES:
patent: 3890407 (1975-06-01), Briggs et al.
patent: 4343921 (1982-08-01), Piestert
patent: 4569976 (1986-02-01), Zimmerman et al.

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