Adhesive bond degradation monitor

Details Adhesive bond degradation monitor Adhesive bond degradation monitor

1991-12-23

1993-09-14

Wieder, Kenneth A.

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

324693, 324 711, 156 64, G01R 2726

Patent

active

052452930

ABSTRACT:
A method and apparatus for detecting changes in the structural strength of bonded joint. Changes in one or more dielectric properties of the bonding adhesive, such as resistance and capacitance, are monitored by a microdielectrometer. A change in a bond dielectric measurement is indicative of a moisture intrusion in the bond and a corresponding weakening of the structural integrity of the bond. A warning or indication of the bond degradation is provided in response to such changes.

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