Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-11-27
2007-11-27
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S455000
Reexamination Certificate
active
10801894
ABSTRACT:
An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.
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Gall Thomas P.
Jiao Jinbao
Moore Kevin D.
Weigler William C.
Nguyen Khiem D
Smith Matthew
Temic Automotive of North America, Inc.
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