Adhesive application apparatus for use with an assembling...

Details Adhesive application apparatus for use with an assembling... Adhesive application apparatus for use with an assembling...

2011-06-28

2011-06-28

Tucker, Philip C (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S538000, C156S578000, C156S351000, C156S556000, C156S575000

Reexamination Certificate

active

07967046

ABSTRACT:
The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms.

REFERENCES:
patent: 3783499 (1974-01-01), Hughes et al.
patent: 6183589 (2001-02-01), Kim et al.
patent: 6436156 (2002-08-01), Wandeloski et al.
patent: 2004/0207688 (2004-10-01), Silverbrook et al.
patent: 11168111 (1999-06-01), None

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