Adhesive and solder connection device

Metal fusion bonding – Solder form

Patent

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Details

174 84R, 174DIG8, H01R 470, B23K 300

Patent

active

048322482

ABSTRACT:
A device for electrically connecting together two wires and sealing the joint comprises a dimensionally-recoverable sleeve having a central solder insert and end adhesive inserts. The adhesive inserts comprise a higher viscosity adhesive that acts as a dam restricting flow of the lower viscosity adhesive.

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