Metal fusion bonding – Solder form
Patent
1986-11-20
1989-05-23
Ramsey, Kenneth J.
Metal fusion bonding
Solder form
174 84R, 174DIG8, H01R 470, B23K 300
Patent
active
048322482
ABSTRACT:
A device for electrically connecting together two wires and sealing the joint comprises a dimensionally-recoverable sleeve having a central solder insert and end adhesive inserts. The adhesive inserts comprise a higher viscosity adhesive that acts as a dam restricting flow of the lower viscosity adhesive.
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Rawls Jerry S.
Soni Pravin L.
Belcher Simon J.
Burkard Herbert G.
Ramsey Kenneth J.
Raychem Corporation
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