Adhesive and electric device

Details Adhesive and electric device Adhesive and electric device

2006-05-09

2006-05-09

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

C252S518100, C252S502000, C252S514000, C257S783000, C257S789000, C438S644000

Reexamination Certificate

active

07041237

ABSTRACT:
The particle diameter distribution of the filler material added to the adhesive of the invention has the first peak and the second peak positioned on a side of smaller particle diameters with respect to the first peak by 0.7μ or more, and thus the rigidity of the hardened adhesive is improved. Therefore, the connection reliability of the electric device5having the semiconductor chip11and the substrate13by using the adhesive (adhesive film15) is improved.

REFERENCES:
patent: 6410642 (2002-06-01), Yamakawa et al.
patent: 6750550 (2004-06-01), Yamakawa et al.
patent: 6812065 (2004-11-01), Kitamura
patent: 1 085 790 (2001-03-01), None
patent: A 62-143986 (1987-06-01), None
patent: 06-009754 (1994-01-01), None
patent: A 2000-239627 (2000-09-01), None
patent: 2001-049220 (2001-02-01), None
patent: A 2001-49220 (2001-02-01), None
patent: 2000-309768 (2000-11-01), None

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