Adhesive and bonding process

Stock material or miscellaneous articles – Composite – Of metal

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428522, 525188, 525190, 525213, B32B 1508, B32B 2706, C08L 8502

Patent

active

049045350

ABSTRACT:
An adhesive having superior adhesive properties between metal/metal, metal/plastic or plastic/plastic and a bonding process therebetween are provided, which adhesive is composed mainly of a copolymer comprising the respective units of 50 to 95% by weight of vinyl chloride, 5 to 50% by weight of a vinyl carboxylate ester and 0.01 to 5% by weight of a phosphoric acid ester having a C--C double bond and copolymerizable with the foregoing vinyl monomers, and having an average degree of polymerization of 100 to 900, and which bonding process comprises dissolving the adhesive in an organic solvent, coating the solution onto substrates, drying the coated substrate and bonding the substrates onto each other on heating under pressure.

REFERENCES:
patent: 2329456 (1943-09-01), Campbell
patent: 4724186 (1988-02-01), Kelch
patent: 4731292 (1988-03-01), Sasaki et al.
patent: 4740427 (1988-04-01), Ochiumi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Adhesive and bonding process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive and bonding process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive and bonding process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-173217

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.