Adhesive aided transfer of chips

Details Adhesive aided transfer of chips Adhesive aided transfer of chips

1985-05-17

1988-02-09

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156330, C09J 314, C09J 506

Patent

active

047240300

ABSTRACT:
A transfer pin (40) simultaneously transfers a die (10) to an adhesively ted, electrically conductive cup (23) while depositing adhesive on the upper surface of the die for subsequent bonding.

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