Adhesive agent for substrate of electroless plating, printed cir

Details Adhesive agent for substrate of electroless plating, printed cir Adhesive agent for substrate of electroless plating, printed cir

1993-01-05

1994-10-18

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428323, 428327, 428355, 428901, 427 97, 430 15, B32B 900

Patent

active

053566980

ABSTRACT:
Adhesive agent for substrate of electroless plating characterized in comprising epoxy resin, synthetic rubber, and phenolic resin as main components, a hardener of the epoxy resin, inorganic filler having hydroxyl group, and solvent.
The adhesive agent is hardened at relatively low temperature (about 150.degree. C.) in short period (within 30 minutes) without giving warp and distortion to the insulation substrate, and moreover its insulation resistance after hardening is high.
The adhesive agent is preferable as an adhesive agent for a printed circuit board.

REFERENCES:
patent: 4305975 (1981-12-01), Ikari et al.
patent: 4378384 (1983-03-01), Murakami et al.

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