Adhesion test instrument

Details Adhesion test instrument Adhesion test instrument

1979-07-13

1981-04-28

Myracle, Jerry W.

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73 156, G01N 308

Patent

active

042638119

ABSTRACT:
Method and apparatus for measuring the normal stress required to remove an adhering thermoplastic rod from a substrate. Tensile strength of a bond can be measured reproducibly under controlled conditions. The tip of a thermoplastic rod, machined to a cone, is lowered into contact with a heated substrate and melting of the rod is allowed to proceed to a steady-state condition. After a bond is formed, the force required to break the bond is measured. The method permits rapid simulation of the essential conditions present during bond formation between a mineral filler surface and a polymer matrix.

REFERENCES:
patent: 2763149 (1956-09-01), Long et al.
patent: 3214971 (1965-11-01), Hammond Jr.
patent: 3590631 (1971-07-01), Gonze

Affiliated with

Also associated with

Rating

Adhesion test instrument does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesion test instrument, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesion test instrument will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-857728