Adhesion promotion in printed circuit boards

Details Adhesion promotion in printed circuit boards Adhesion promotion in printed circuit boards

2007-06-19

2007-06-19

Green, Anthony J. (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Corrosion inhibiting coating composition

C106S014440, C106S287260, C148S243000, C148S248000, C148S282000, C252S079100, C252S079200

Reexamination Certificate

active

10619198

ABSTRACT:
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

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