Adhesion promoter for thermoplastic substrates and method employ

Details Adhesion promoter for thermoplastic substrates and method employ Adhesion promoter for thermoplastic substrates and method employ

1989-04-27

1991-08-13

Gallagher, John J.

Plastic and nonmetallic article shaping or treating: processes

Treating shaped or solid article

Solvent polishing type

106311, 156 83, 156240, 156281, 1563093, 252364, B29C 7100

Patent

active

050394720

ABSTRACT:
This invention relates to an adhesion promoting composition and method for its use for promoting adhesion of printed circuits on thermoplastic substrates. The composition includes isopropanol with either methylene chloride or resorcinol. An added ingredient includes polycyclohexanone. The preferred substrate is polyarylsulfone.

REFERENCES:
patent: 2153895 (1939-04-01), McKittrick et al.
patent: 3625763 (1971-12-01), Melillo
patent: 4056403 (1977-11-01), Cramer et al.

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