Adhesion promoter compostion on the basis of polyamide

Stock material or miscellaneous articles – Hollow or container type article – Polymer or resin containing

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428421, 4284744, 4284763, 525420, B29D 2200

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active

058691570

ABSTRACT:
The invention is directed to a new adhesion promoter composition based on polyamide having an excess of amino end groups and at least one diamine added to the polymerized polyamide, said diamine being selected from substituted or unsubstituted, aliphatic C.sub.4 -C.sub.20 diamines or mixtures thereof. The adhesion promoter tightly connects thermoplastically workable fluoropolymers based on VDF, TFE and HFP with polyamides. The invention is also directed to thermoplastic multi-layer composites having at least one inside layer of thermoplastically workable fluoropolymers, at least one adhesion promoter layer composed of the aforementioned adhesion promoter molding compound, and having at least one polyamide outside layer, wherein these layers are tightly connected to one another. Finally, the invention is directed to multi-layer polymer tubes.

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patent: 5140098 (1992-08-01), Pipper et al.
patent: 5170011 (1992-12-01), Martucci
patent: 5383087 (1995-01-01), Noone et al.
patent: 5510160 (1996-04-01), Jadamus et al.
patent: 5656121 (1997-08-01), Fukushi

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