Adhesion promoter

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C524S262000, C524S263000

Reexamination Certificate

active

07579394

ABSTRACT:
An adhesion promoter for a hot melt adhesive or a pressure sensitive adhesive prepared by admixing a hydrolytic silane compound with an aqueous buffer solution. The adhesive is able to bind at very low surface free energy substrates, such as Xerographic prints contaminated by silicone fuser oil. The hot melt adhesive maintains a substantially stable viscosity at temperature ranging from about 100° C. to about 200° C.

REFERENCES:
patent: 4029827 (1977-06-01), Imperial et al.
patent: 4101686 (1978-07-01), Strella et al.
patent: 4140733 (1979-02-01), Meyer, Jr. et al.
patent: 4185140 (1980-01-01), Strella et al.
patent: 4197380 (1980-04-01), Chao et al.
patent: 4576985 (1986-03-01), Ono
patent: 4618640 (1986-10-01), Tsuchida et al.
patent: 4660858 (1987-04-01), Flanagan
patent: 4712808 (1987-12-01), Beh-Forrest et al.
patent: 4772650 (1988-09-01), Ou-Yang
patent: 4942195 (1990-07-01), Flanagan et al.
patent: 5021499 (1991-06-01), Tochinai et al.
patent: 5037874 (1991-08-01), Nuttens et al.
patent: 5057561 (1991-10-01), Manica et al.
patent: 5063271 (1991-11-01), Jones
patent: 5157445 (1992-10-01), Shoji et al.
patent: 5401791 (1995-03-01), Milks
patent: 5518571 (1996-05-01), Puerkner et al.
patent: 6060550 (2000-05-01), Simon et al.
patent: 6582829 (2003-06-01), Quinn et al.
patent: 6794443 (2004-09-01), Chu et al.
patent: 6797774 (2004-09-01), Kijima
patent: 6800680 (2004-10-01), Stark et al.
patent: 6833404 (2004-12-01), Quinn et al.
patent: 6890982 (2005-05-01), Borsinger et al.
patent: 6989413 (2006-01-01), Hazen et al.
patent: 2003/0108737 (2003-06-01), Timmons et al.
patent: 2004/0102558 (2004-05-01), Lin et al.
patent: 2004/0185272 (2004-09-01), Kaplan et al.
patent: 2005/0261416 (2005-11-01), Morrison et al.
patent: 2006/0008727 (2006-01-01), Gervasi et al.
patent: 2007/0190345 (2007-08-01), Sutter et al.
U.S. Appl. No. 11/532,704, filed Sep. 18, 2006 in the name of Jyothsna Ram et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Adhesion promoter does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesion promoter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesion promoter will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4108950

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.