Adhesion promoter

Stock material or miscellaneous articles – Composite – Of polyamide

Patent

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Details

428421, 4284763, B32B 2708

Patent

active

058691901

ABSTRACT:
The invention is directed to a new adhesion promoter composition based on polyamide having an excess of amino end groups and at least one diamine added to the polymerized polyamide, said diamine being selected from substituted or unsubstituted, aliphatic C.sub.4 -C.sub.20 diamines or mixtures thereof. The adhesion promoter tightly connects thermoplastically workable fluoropolymers based on VDF, TFE and HFP with polyamides. The invention is also directed to thermoplastic multi-layer composites having at least one inside layer of thermoplastically workable fluoropolymers, at least one adhesion promoter layer composed of the aforementioned adhesion promoter molding compound, and having at least one polyamide outside layer, wherein these layers are tightly connected to one another. Finally, the invention is directed to multi-layer polymer tubes.

REFERENCES:
patent: 4319019 (1982-03-01), Lehmann et al.
patent: 4543378 (1985-09-01), Suhara et al.
patent: 5140098 (1992-08-01), Pipper et al.
patent: 5170011 (1992-12-01), Martucci
patent: 5383087 (1995-01-01), Noone et al.
patent: 5510160 (1996-04-01), Jadamus et al.
patent: 5656121 (1997-08-01), Fukushi

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