Adhesion primers for encapsulating epoxies

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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29588, 156245, 156289, 1563075, 1563077, 174 52PE, 264135, 26427217, 427410, 428413, 428469, 523400, 523455, 523457, C09J 500

Patent

active

045825564

ABSTRACT:
A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.

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