Adhesion primers for encapsulating epoxies

Details Adhesion primers for encapsulating epoxies Adhesion primers for encapsulating epoxies

1982-11-22

1985-06-25

Lesmes, George F.

Stock material or miscellaneous articles

Composite

Of epoxy ether

148 616, 264300, 427 96, 428461, B32B 1508

Patent

active

045254222

ABSTRACT:
A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.

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