Adhesion of polyamide or polyester cords to EPDM rubber

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156110A, 260 293, 260 38, 525133, 525139, B29H 900, C08L 6112

Patent

active

042857562

ABSTRACT:
An aqueous alkaline dispersion of a rubbery polybutadiene and a water soluble, heat reactive phenolic resin is useful in forming an adhesive for bonding polyamide or polyester reinforcing elements or cords to ethylene-propylene-diene rubbery polymer (EPDM) compounds or stocks. After dipping the polyamide or polyester cord in the adhesive dip, the coated cord is heated to dry it and heat cure or heat set the adhesive on the cord. Thereafter, the adhesive containing polyamide or polyester cord is combined with, or laminated to (calendered), a curable or vulcanizable EPDM compound and the resulting assembly is cured to form a composite in which the polymide or polyester cord is bonded to the EPDM rubber by means of said adhesive.

REFERENCES:
patent: 3300426 (1967-01-01), Hunsucker
patent: 3578613 (1971-05-01), Tai
patent: 3787224 (1974-01-01), Uffner
patent: 3855168 (1974-12-01), Ozeki et al.
patent: 3888813 (1975-06-01), Moult et al.
patent: 4197228 (1980-04-01), Lin et al.

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