Adhesion of phenolics to copper

Details Adhesion of phenolics to copper Adhesion of phenolics to copper

1979-06-29

1981-07-28

Schain, Howard E.

Stock material or miscellaneous articles

Composite

Of metal

260 457SE, 525505, 528158, 32B 2742, B32B 1508

Patent

active

042810442

ABSTRACT:
The bonding of phenolic resins and phenolic molding materials to copper is significantly improved by the addition to the phenolic material of elemental sulfur in a weight percentage from 0.005% to 1%, the weight percentage of sulfur being preferably from 0.01% to 0.2%.

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patent: 2920990 (1960-01-01), Been et al.
patent: 3066060 (1962-11-01), Gross
patent: 3455851 (1969-07-01), Meredith et al.
patent: 3915664 (1975-10-01), Busch et al.
patent: 4163030 (1979-07-01), Banucci et al.
Kirk-Othmer, Encycl. of Chem. Technology, vol. 2, 1964, pp. 745-746.
Phenoplasts, Carswell, p. 95, 1947.

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