Measuring and testing – Surface and cutting edge testing – Roughness
Patent
1994-09-29
1995-12-26
Williams, Hezron E.
Measuring and testing
Surface and cutting edge testing
Roughness
G01B 2130
Patent
active
054777321
ABSTRACT:
An adhesion measuring apparatus includes a measuring device for measuring a Force-Curve at each of multiple measuring points on a sample surface using a cantilever provided at its distal end with a probe which is made of a material to be formed on the sample surface, and a distribution image forming device for calculating adhesion between a material making up the sample surface and the material to be formed on the sample surface from an output of the measuring device, and forming an image of adhesion distribution on the sample surface. An adhesion measuring method includes the steps of adjusting the spacing between a probe which is provided at the distal end of a cantilever and made of a material to be formed on a sample surface and the sample surface to measure a Force-Curve at each of multiple measuring points on the sample surface, calculating adhesion between a material making up the sample surface and the material to be formed on the sample surface at each of the measuring points from the result of measuring the Force-Curve, and forming an image of adhesion distribution on the sample surface from the adhesion calculated for each of the measuring points. With the present adhesion measuring apparatus and method, the condition of the sample surface can be accurately determined at an atomic level.
REFERENCES:
patent: 5193383 (1993-03-01), Burnham et al.
patent: 5237859 (1993-08-01), Elings et al.
patent: 5308974 (1994-05-01), Elings et al.
patent: 5329808 (1994-07-01), Elings et al.
patent: 5363697 (1994-11-01), Nakagawa
patent: 5372930 (1994-12-01), Colton et al.
Burenham et al., "Measuring the Nanomechanical Properties and Surface Forces of Materials Using an Atomic Force Microscope", Journal of Vac. Sci. Technology, vol. A7, No. 4, Jul./Aug. 1989, pp. 2906-2913.
Nakagawa et al, "Discriminating Molecular Length of Chemically Adsorbed Molecules Using An Atomic Force Microscope Having A Tip Covered With Sensor Molecules (An Atomic Force Microscope Having Chemical Sensing Function)", Japanese Journal of Applied Physics, vol. 32, Part 2, No. 2B, Feb. 1993, pp. L294-L296.
Nishioka Tadashi
Yasue Takao
Larkin Daniel S.
Mitsubishi Denki & Kabushiki Kaisha
Ryoden Semiconductor System Engineering Corporation
Williams Hezron E.
LandOfFree
Adhesion measuring method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesion measuring method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesion measuring method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1361953