Adhesion enhancement for underplating problem

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

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Details

205122, 205183, C25D 502

Patent

active

057559473

ABSTRACT:
Underplating between a metallic plating base and a photoresist deposited reon can be reduced or eliminated by a method of fabricating a microstructure which includes the steps of:

REFERENCES:
patent: 3644184 (1972-02-01), Smith
patent: 4988413 (1991-01-01), Chakravorty
patent: 5098860 (1992-03-01), Chakravorty
patent: 5470693 (1995-11-01), Sachdev

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