Adherence of a solid-state image-sensing device to a substrate

Details Adherence of a solid-state image-sensing device to a substrate Adherence of a solid-state image-sensing device to a substrate

2006-05-19

2008-10-14

Yam, Stephen (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

C257S431000, C250S214100

Reexamination Certificate

active

07435948

ABSTRACT:
To provide a solid-state image sensing device that is capable of improving the connection reliability of bonding pads and bonding wires. A solid-state image sensing element1of the present invention contains a long plate-shaped metal substrate16, a long plate-shaped solid-state image sensing element4fixed to the surface of the metal substrate16via an adhesive layer18, and bonding pads6, formed on the surface of the solid-state image sensing element4, for electrically connecting to the lead frame via bonding wires14. The adhesive layer18contains a first adhesive layer18a, and a second adhesive layer18bof a higher modulus of elasticity than the first adhesive layer18a, and at the regions directly below the bonding pads6provided at both end sections in a longitudinal direction of the solid-state image sensing element4, the metal substrate16and the solid-state image sensing element4are fixed via the second adhesive layer18b.

REFERENCES:
patent: 5988707 (1999-11-01), Abe et al.
patent: 6226187 (2001-05-01), Questad et al.
patent: 6404049 (2002-06-01), Shibamoto et al.
patent: 6483567 (2002-11-01), Okada
patent: 6706961 (2004-03-01), Shimizu et al.
patent: 6800836 (2004-10-01), Hamamoto et al.
patent: 2004/0016873 (2004-01-01), Kida et al.
patent: 09-260407 (1997-10-01), None
patent: 2005-019680 (2005-01-01), None

Affiliated with

Also associated with

Rating

Adherence of a solid-state image-sensing device to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adherence of a solid-state image-sensing device to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adherence of a solid-state image-sensing device to a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4002248