Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1995-01-09
1996-05-14
Wieder, Kenneth A.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324754, 427 96, 29840, C23C 2600, H01L 2348, H01L 2944
Patent
active
055171273
ABSTRACT:
A structure and method for achieving burn-in and full functional testing of a semiconductor wire bond die are provided. The structure comprises an electrical conductor which connects a wire bond pad to a solderable test contact laterally displaced from the wire bond pad. The solderable test contact is configured to facilitate electrical connection of an external testing device thereto for electrical testing and/or burn-in of integrated circuitry associated with the die, without direct physical contact to the wire bond pads. The structure does not need to be removed following the burn-in or test.
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Bergeron Richard J.
LaMothe Thomas J.
Suarez Joseph E.
Thompson John A.
Bowser Barry C.
International Business Machines - Corporation
Wieder Kenneth A.
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