Additive process for producing printed circuit elements using a

Details Additive process for producing printed circuit elements using a Additive process for producing printed circuit elements using a

1976-12-22

1977-10-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

96 351, 96 384, 156230, 156249, 156902, 174 685, 427 97, 427 98, H05K 318

Patent

active

040544796

ABSTRACT:
Printed circuit boards with plated through-holes are prepared by an electroless plating process using a self-supported, adherent, photohardenable sheet. The self-supported photohardenable sheet preferably is composed of a photopolymerizable material and may be a thick, homogeneous sheet or it may be a sheet reinforced with a foraminous material therein. The self-supported sheet is imagewise exposed to actinic radiation to form an adherent circuit pattern thereon comprising the unexposed areas. Through-holes are introduced into the pad areas of the circuit pattern, powdered catalyst is applied to the adherent pattern and through-holes and the catalytic image is plated in an electroless plating bath. The self-supported sheet may be used without additional catalyzing steps to make single sided, two-sided or multilayered printed circuit boards with plated throughholes and interconnections.

REFERENCES:
patent: 3436468 (1969-04-01), Haberecht
patent: 3615471 (1971-10-01), Lenoble et al.
patent: 3646572 (1972-02-01), Burr
patent: 3778900 (1973-12-01), Haining et al.
patent: 3934335 (1976-01-01), Nelson
patent: 3956041 (1976-05-01), Polichette et al.

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