Additive printed circuit process

Details Additive printed circuit process Additive printed circuit process

1983-05-02

1984-09-11

Smith, John D.

Chemistry: electrical and wave energy

Processes and products

204 38B, 20412935, 427 96, 427 98, H05K 312

Patent

active

044708831

ABSTRACT:
Electrical conductors having enhanced resolution/spacing and adhesion characteristics are prepared by applying a mixture of a carbonyl-processed nickel powder and a polymer to a substrate, curing the polymer, and immersing the cured polymer pattern in an augmentative-replacement/electroplating bath, to effect an augmentative replacement reaction to form a contiguous layer of conducting metal on the substrate and thereafter electroplating an additional metal layer on the contiguous layer.

REFERENCES:
patent: 3506482 (1970-04-01), Hirohata
patent: 3576662 (1971-04-01), Diebold
patent: 3764280 (1973-10-01), Lupinski
patent: 4404237 (1983-09-01), Eichelberger

Affiliated with

Also associated with

Rating

Additive printed circuit process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Additive printed circuit process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Additive printed circuit process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1193857