Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1973-12-14
1976-05-25
Kendall, Ralph S.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427282, 427306, 427404, C23C 302, B05D 512
Patent
active
039595234
ABSTRACT:
Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by an all-additive electroless deposition technique, in which the characterizing feature is the use of a two-stage metal deposition to build up the desired total thickness of metal. In the first stage a fine grained, thin deposit of metal is produced on the substrate which is then water rinsed and immersed in a second metal bath having a sufficiently high rate of deposition to produce the desired total thickness of metal in a commercially practical period of time. Improved adhesion of plated metal to the resin substrate, both before and after thermal shock, is achieved by resort to this two-stage plating procedure.
REFERENCES:
patent: 3562038 (1971-02-01), Shipley et al.
patent: 3666549 (1972-05-01), Rhodenizek et al.
patent: 3698940 (1972-10-01), Mersereau et al.
patent: 3745095 (1973-07-01), Chadwick et al.
D'Ottavio Eugene D.
Grunwald John J.
Jacovich Elaine F.
Kukanskis Peter E.
Kendall Ralph S.
MacDermid Incorporated
Smith John D.
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